TELE Revenues Slump as Tariff War Looms

By Editorial Team 05/09/2019
Summary

PT Tiphone Mobile Indonesia Tbk plans to issue bonds worth Rp 500 billion as part of Tiphone's shelf-registration bond II with a total funds target of Rp 2 trillion. Citing the information disclosure on the IDX, Wednesday (9/4), the bond offering period will be on September 13, 2019.

The TELE stock-coded phone retailer will use the proceeds from bond issuance to pay off the principal amount of 2016 Series B shelf-registration bond I which will mature on October 14, 2019, totaling Rp 256 billion. The remaining proceeds will be disbursed as loans for its subsidiaries, PT Telesindo Shop, PT Simpatindo Multi Media, and PT Perdana Mulia Makmur.

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